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Tikale, Sanjay, Sona, Mrunali, Prabhu, K.N. (2015) Wettability and Bond Shear Strength of Sn-9Zn Lead-Free Solder Alloy Reflowed on Copper Substrate. Materials Science Forum, 830. 215-218 doi:10.4028/www.scientific.net/msf.830-831.215

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Reference TypeJournal (article/letter/editorial)
TitleWettability and Bond Shear Strength of Sn-9Zn Lead-Free Solder Alloy Reflowed on Copper Substrate
JournalMaterials Science Forum
AuthorsTikale, SanjayAuthor
Sona, MrunaliAuthor
Prabhu, K.N.Author
Year2015 (September)Volume830
PublisherTrans Tech Publications, Ltd.
DOIdoi:10.4028/www.scientific.net/msf.830-831.215Search in ResearchGate
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Mindat Ref. ID9884060Long-form Identifiermindat:1:5:9884060:3
GUID0
Full ReferenceTikale, Sanjay, Sona, Mrunali, Prabhu, K.N. (2015) Wettability and Bond Shear Strength of Sn-9Zn Lead-Free Solder Alloy Reflowed on Copper Substrate. Materials Science Forum, 830. 215-218 doi:10.4028/www.scientific.net/msf.830-831.215
Plain TextTikale, Sanjay, Sona, Mrunali, Prabhu, K.N. (2015) Wettability and Bond Shear Strength of Sn-9Zn Lead-Free Solder Alloy Reflowed on Copper Substrate. Materials Science Forum, 830. 215-218 doi:10.4028/www.scientific.net/msf.830-831.215
In(2015) Materials Science Forum Vol. 830. Trans Tech Publications, Ltd.

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Sona, Mrunali, Narayan Prabhu, K. (2015) Wetting Kinetics and Joint Strength of Sn-0.3Ag-0.7Cu Lead-Free Solder Alloy on Copper Substrate as a Function of Reflow Time. Materials Science Forum, 830. 286-289 doi:10.4028/www.scientific.net/msf.830-831.286
Satyanarayan, , Prabhu, K.N. (2015) Solder Joint Reliability of Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys Solidified on Copper Substrates with Different Surface Roughnesses. Materials Science Forum, 830. 265-269 doi:10.4028/www.scientific.net/msf.830-831.265
Sona, Mrunali, Tikale, Sanjay, Prabhu, Narayan (2019) Wettability, Interfacial Intermetallic Growth and Joint Shear Strength of Eutectic Sn–Cu Solder Reflowed on Bare and Nickel-Coated Copper Substrates. Transactions of the Indian Institute of Metals, 72. 1579-1583 doi:10.1007/s12666-019-01568-5
Satyanarayan, , Prabhu, K.N. (2012) Wetting Characteristics of Sn-0.7Cu Lead-Free Solder Alloy on Copper Substrates. Materials Science Forum, 710. 569-574 doi:10.4028/www.scientific.net/msf.710.569
Vijayan, Vijeesh, Prabhu, K.N. (2015) Assessment of Latent Heat and Solid Fraction of Al-22Si Alloy Using Newtonian and Fourier Analysis Techniques. Materials Science Forum, 830. 321-324 doi:10.4028/www.scientific.net/msf.830-831.321
Sona, Mrunali, Narayan Prabhu, K. (2015) Spreading Behaviour and Joint Reliability of Sn–0.3Ag–0.7Cu Lead-Free Solder Alloy on Nickel Coated Copper Substrate as a Function of Reflow Time. Transactions of the Indian Institute of Metals, 68. 1027-1031 doi:10.1007/s12666-015-0640-7
Prabhu, K.N., Deshapande, Parashuram, Satyanarayan, (2012) Effect of cooling rate during solidification of Sn–9Zn lead-free solder alloy on its microstructure, tensile strength and ductile–brittle transition temperature. Materials Science and Engineering: A, 533. 64-70 doi:10.1016/j.msea.2011.11.035
Chantaramanee, Suchart, Sriwittayakul, Worawit, Sungkhaphaitoon, Phairote (2018) Effects of Antimony and Indium Addition on Wettability and Interfacial Reaction of Sn-3.0Ag-0.5Cu Lead Free Solder on Copper Substrate. Materials Science Forum, 928. 188-193 doi:10.4028/www.scientific.net/msf.928.188
Shetty, Sandhya, Hegde, Ampar Chitharanjan (2015) Electrodeposition of Sn-Ni Alloy Coatings and their Characterization. Materials Science Forum, 830. 655-658 doi:10.4028/www.scientific.net/msf.830-831.655
Tikale, Sanjay, Narayan Prabhu, K. (2018) Effect of Multiple Reflow Cycles on the Shear Strength of Nano-Al2O3 Particles Reinforced Sn3.6Ag Lead-Free Solder Alloy. Transactions of the Indian Institute of Metals, 71. 2855-2859 doi:10.1007/s12666-018-1413-x
Mandal, P.K., Kant, Ravi (2015) Effect of Microalloying Elements on Mechanical Properties in the High Strength Low Alloy Steel. Materials Science Forum, 830. 231-233 doi:10.4028/www.scientific.net/msf.830-831.231
 
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