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Sona, Mrunali, Narayan Prabhu, K. (2015) Wetting Kinetics and Joint Strength of Sn-0.3Ag-0.7Cu Lead-Free Solder Alloy on Copper Substrate as a Function of Reflow Time. Materials Science Forum, 830. 286-289 doi:10.4028/www.scientific.net/msf.830-831.286

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Reference TypeJournal (article/letter/editorial)
TitleWetting Kinetics and Joint Strength of Sn-0.3Ag-0.7Cu Lead-Free Solder Alloy on Copper Substrate as a Function of Reflow Time
JournalMaterials Science Forum
AuthorsSona, MrunaliAuthor
Narayan Prabhu, K.Author
Year2015 (September)Volume830
PublisherTrans Tech Publications, Ltd.
DOIdoi:10.4028/www.scientific.net/msf.830-831.286Search in ResearchGate
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Mindat Ref. ID9884079Long-form Identifiermindat:1:5:9884079:1
GUID0
Full ReferenceSona, Mrunali, Narayan Prabhu, K. (2015) Wetting Kinetics and Joint Strength of Sn-0.3Ag-0.7Cu Lead-Free Solder Alloy on Copper Substrate as a Function of Reflow Time. Materials Science Forum, 830. 286-289 doi:10.4028/www.scientific.net/msf.830-831.286
Plain TextSona, Mrunali, Narayan Prabhu, K. (2015) Wetting Kinetics and Joint Strength of Sn-0.3Ag-0.7Cu Lead-Free Solder Alloy on Copper Substrate as a Function of Reflow Time. Materials Science Forum, 830. 286-289 doi:10.4028/www.scientific.net/msf.830-831.286
In(2015) Materials Science Forum Vol. 830. Trans Tech Publications, Ltd.

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Tikale, Sanjay, Sona, Mrunali, Prabhu, K.N. (2015) Wettability and Bond Shear Strength of Sn-9Zn Lead-Free Solder Alloy Reflowed on Copper Substrate. Materials Science Forum, 830. 215-218 doi:10.4028/www.scientific.net/msf.830-831.215
Sona, Mrunali, Narayan Prabhu, K. (2015) Spreading Behaviour and Joint Reliability of Sn–0.3Ag–0.7Cu Lead-Free Solder Alloy on Nickel Coated Copper Substrate as a Function of Reflow Time. Transactions of the Indian Institute of Metals, 68. 1027-1031 doi:10.1007/s12666-015-0640-7
Satyanarayan, , Prabhu, K.N. (2015) Solder Joint Reliability of Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys Solidified on Copper Substrates with Different Surface Roughnesses. Materials Science Forum, 830. 265-269 doi:10.4028/www.scientific.net/msf.830-831.265
Satyanarayan, , Prabhu, K.N. (2012) Wetting Characteristics of Sn-0.7Cu Lead-Free Solder Alloy on Copper Substrates. Materials Science Forum, 710. 569-574 doi:10.4028/www.scientific.net/msf.710.569
Sona, Mrunali, Prabhu, K. Narayan (2016) Assessment of Joint Reliability of Sn–2.5Ag–0.5Cu Solder/Cu as a Function of Reflow Time. Transactions of the Indian Institute of Metals, 69. 941-947 doi:10.1007/s12666-015-0590-0
Pai, Ashwin, Vignesh Nayak, U., Pranesh Rao, K.M., Prabhu, K. Narayan (2015) Wetting Kinetics and Cooling Performance of PAG Polymer Quenchants. Materials Science Forum, 830. 156-159 doi:10.4028/www.scientific.net/msf.830-831.156
Pranesh Rao, K.M., Prabhu, K. Narayan (2015) Assessment of Wetting Kinematics and Cooling Performance of Select Vegetable Oils and Mineral-Vegetable Oil Blend Quench Media. Materials Science Forum, 830. 160-163 doi:10.4028/www.scientific.net/msf.830-831.160
Sudheer, R., Prabhu, K. Narayan (2015) Characterization of Metal-PCMs for Thermal Energy Storage Applications. Materials Science Forum, 830. 505-508 doi:10.4028/www.scientific.net/msf.830-831.505
Vignesh Nayak, U., Prabhu, K. Narayan (2015) Heat Transfer during Immersion Quenching in MWCNT Nanofluids. Materials Science Forum, 830. 172-176 doi:10.4028/www.scientific.net/msf.830-831.172
Feng, Xiao Le, Yang, Jie (2015) Effect of Pr on Wettability and Mechanical Property of Sn-0.3Ag-0.7Cu Lead-Free Solder. Advanced Materials Research, 1120. 456-461 doi:10.4028/www.scientific.net/amr.1120-1121.456
Sona, Mrunali, Tikale, Sanjay, Prabhu, Narayan (2019) Wettability, Interfacial Intermetallic Growth and Joint Shear Strength of Eutectic Sn–Cu Solder Reflowed on Bare and Nickel-Coated Copper Substrates. Transactions of the Indian Institute of Metals, 72. 1579-1583 doi:10.1007/s12666-019-01568-5
 
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