Reference Type | Journal (article/letter/editorial) |
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Title | Si Wafer Bonding with Ta Silicide Formation |
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Journal | Japanese Journal of Applied Physics |
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Authors | Fukuroda, Atsushi | Author |
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Sugii, Toshihiro | Author |
Arimoto, Yoshihiro | Author |
Ito, Takashi | Author |
Year | 1991 (October 1) | Volume | 30 |
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Publisher | Japan Society of Applied Physics |
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DOI | doi:10.1143/jjap.30.l1693Search in ResearchGate |
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| Generate Citation Formats |
Mindat Ref. ID | 14996864 | Long-form Identifier | mindat:1:5:14996864:7 |
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GUID | 0 |
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Full Reference | Fukuroda, Atsushi, Sugii, Toshihiro, Arimoto, Yoshihiro, Ito, Takashi (1991) Si Wafer Bonding with Ta Silicide Formation. Japanese Journal of Applied Physics, 30. doi:10.1143/jjap.30.l1693 |
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Plain Text | Fukuroda, Atsushi, Sugii, Toshihiro, Arimoto, Yoshihiro, Ito, Takashi (1991) Si Wafer Bonding with Ta Silicide Formation. Japanese Journal of Applied Physics, 30. doi:10.1143/jjap.30.l1693 |
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In | (1991) Japanese Journal of Applied Physics Vol. 30. Japan Society of Applied Physics |
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