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Jeong, Woo-Ju, Nishikawa, Hiroshi, Itou, Daisuke, Takemoto, Tadashi (2005) Electrical Characteristics of a New Class of Conductive Adhesive. MATERIALS TRANSACTIONS, 46 (10). 2276-2281 doi:10.2320/matertrans.46.2276

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Reference TypeJournal (article/letter/editorial)
TitleElectrical Characteristics of a New Class of Conductive Adhesive
JournalMATERIALS TRANSACTIONS
AuthorsJeong, Woo-JuAuthor
Nishikawa, HiroshiAuthor
Itou, DaisukeAuthor
Takemoto, TadashiAuthor
Year2005Volume46
Issue10
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.46.2276Search in ResearchGate
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Mindat Ref. ID7777826Long-form Identifiermindat:1:5:7777826:8
GUID0
Full ReferenceJeong, Woo-Ju, Nishikawa, Hiroshi, Itou, Daisuke, Takemoto, Tadashi (2005) Electrical Characteristics of a New Class of Conductive Adhesive. MATERIALS TRANSACTIONS, 46 (10). 2276-2281 doi:10.2320/matertrans.46.2276
Plain TextJeong, Woo-Ju, Nishikawa, Hiroshi, Itou, Daisuke, Takemoto, Tadashi (2005) Electrical Characteristics of a New Class of Conductive Adhesive. MATERIALS TRANSACTIONS, 46 (10). 2276-2281 doi:10.2320/matertrans.46.2276
In(2005) MATERIALS TRANSACTIONS Vol. 46 (10) Japan Institute of Metals

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Jeong, Woo-Ju, Nishikawa, Hiroshi, Gotoh, Hideyuki, Takemoto, Tadashi (2005) Effect of Solvent Evaporation and Shrink on Conductivity of Conductive Adhesive. MATERIALS TRANSACTIONS, 46 (3). 704-708 doi:10.2320/matertrans.46.704
Nishikawa, Hiroshi, Seo, Kouhei, Katayama, Seiji, Takemoto, Tadashi (2005) Application of Nd:YAG Laser to Aluminum Alloy Sorting. MATERIALS TRANSACTIONS, 46 (12). 2641-2646 doi:10.2320/matertrans.46.2641
Nishikawa, Hiroshi, Komatsu, Akira, Takemoto, Tadashi (2005) Interfacial Reaction between Sn–Ag–Co Solder and Metals. MATERIALS TRANSACTIONS, 46 (11). 2394-2399 doi:10.2320/matertrans.46.2394
Nishikawa, Hiroshi, Mikami, Saya, Miyake, Koichi, Aoki, Akira, Takemoto, Tadashi (2010) Effects of Silver Coating Covered with Copper Filler on Electrical Resistivity of Electrically Conductive Adhesives. MATERIALS TRANSACTIONS, 51 (10). 1785-1789 doi:10.2320/matertrans.mj201020
Nishikawa, Hiroshi, Takemoto, Tadashi, Kifune, Kouichi, Uetani, Takashi, Sekimori, Norihisa (2004) Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder. MATERIALS TRANSACTIONS, 45 (3). 741-746 doi:10.2320/matertrans.45.741
Wang, Y. N., Huang, J. C. (2003) Texture Characteristics and Anisotropic Superplasticity of AZ61 Magnesium Alloy. MATERIALS TRANSACTIONS, 44 (11). 2276-2281 doi:10.2320/matertrans.44.2276
Nishikawa, Hiroshi, WongPiromsarn, Krit, Abe, Hiroya, Takemoto, Tadashi, Fukuhara, Mikio, Inoue, Akihisa (2009) Solderability of Bulk Metallic Glasses Using Lead-Free Solders. MATERIALS TRANSACTIONS, 50 (6). 1326-1329 doi:10.2320/matertrans.me200824
Murakami, Yasukazu, Shindo, Daisuke (2005) Recent Advances in Domain Analysis. MATERIALS TRANSACTIONS, 46 (4). 743-755 doi:10.2320/matertrans.46.743
Nishikawa, Hiroshi, Komatsu, Akira, Takemoto, Tadashi (2008) Effect of Ni or Co Addition to Sn-Ag Solder on Microstructure and Joint Strength at Interface. MATERIALS TRANSACTIONS, 49 (7). 1518-1523 doi:10.2320/matertrans.mf200851
Shohji, Ikuo, Yasuda, Kiyokazu, Takemoto, Tadashi (2005) Estimation of Thermal Fatigue Resistances of Sn–Ag and Sn–Ag–Cu Lead-Free Solders Using Strain Rate Sensitivity Index. MATERIALS TRANSACTIONS, 46 (11). 2329-2334 doi:10.2320/matertrans.46.2329
Kim, Woo Jin, Jeong, Hyo Tae (2005) Grain-Size Strengthening in Equal-Channel-Angular-Pressing Processed AZ31 Mg Alloys with a Constant Texture. MATERIALS TRANSACTIONS, 46 (2). 251-258 doi:10.2320/matertrans.46.251
 
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