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Wang, Kai-Kun (2013) Semisolid forging electronic packaging shell with silicon carbon-reinforced copper composites. Rare Metals, 32. 191-195 doi:10.1007/s12598-013-0027-z

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Reference TypeJournal (article/letter/editorial)
TitleSemisolid forging electronic packaging shell with silicon carbon-reinforced copper composites
JournalRare Metals
AuthorsWang, Kai-KunAuthor
Year2013 (April)Volume32
PublisherSpringer Science and Business Media LLC
DOIdoi:10.1007/s12598-013-0027-zSearch in ResearchGate
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Mindat Ref. ID8049507Long-form Identifiermindat:1:5:8049507:3
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Full ReferenceWang, Kai-Kun (2013) Semisolid forging electronic packaging shell with silicon carbon-reinforced copper composites. Rare Metals, 32. 191-195 doi:10.1007/s12598-013-0027-z
Plain TextWang, Kai-Kun (2013) Semisolid forging electronic packaging shell with silicon carbon-reinforced copper composites. Rare Metals, 32. 191-195 doi:10.1007/s12598-013-0027-z
In(2013) Rare Metals Vol. 32. Springer Science and Business Media LLC

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Xu, Bing-Sheng, Zang, Li-Kun, Yuan, Zhang-Fu, Wu, Yan, Zhou, Zhou (2013) Dissolutive wetting process and interfacial characteristic of molten Sn–17Bi–0.5Cu alloy on copper substrate. Rare Metals, 32. 537-543 doi:10.1007/s12598-013-0167-1
WANG, Kai-kun, WANG, Fu-yu, CHEN, Xue-jun, WANG, Lu, MA, Chun-mei (2010) Numerical simulation on thixoforging of electronic packaging shell with SiCp/A356 composites. Transactions of Nonferrous Metals Society of China, 20 (9). 1707-1711 doi:10.1016/s1003-6326(09)60362-9
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