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Gungor, M. Rauf, Maroudas, Dimitrios (1998) Electromigration-induced failure of metallic thin films due to transgranular void propagation. Applied Physics Letters, 72 (26). 3452-3454 doi:10.1063/1.121663

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Reference TypeJournal (article/letter/editorial)
TitleElectromigration-induced failure of metallic thin films due to transgranular void propagation
JournalApplied Physics Letters
AuthorsGungor, M. RaufAuthor
Maroudas, DimitriosAuthor
Year1998 (June 29)Volume72
Issue26
PublisherAIP Publishing
DOIdoi:10.1063/1.121663Search in ResearchGate
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Mindat Ref. ID8521395Long-form Identifiermindat:1:5:8521395:1
GUID0
Full ReferenceGungor, M. Rauf, Maroudas, Dimitrios (1998) Electromigration-induced failure of metallic thin films due to transgranular void propagation. Applied Physics Letters, 72 (26). 3452-3454 doi:10.1063/1.121663
Plain TextGungor, M. Rauf, Maroudas, Dimitrios (1998) Electromigration-induced failure of metallic thin films due to transgranular void propagation. Applied Physics Letters, 72 (26). 3452-3454 doi:10.1063/1.121663
In(1998, June) Applied Physics Letters Vol. 72 (26) AIP Publishing

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Gungor, M. Rauf, Maroudas, Dimitrios (1999) Theoretical analysis of electromigration-induced failure of metallic thin films due to transgranular void propagation. Journal of Applied Physics, 85 (4). 2233-2246 doi:10.1063/1.369532
Gungor, M. Rauf, Maroudas, Dimitrios, Gray, Leonard J. (1998) Effects of mechanical stress on electromigration-driven transgranular void dynamics in passivated metallic thin films. Applied Physics Letters, 73 (26). 3848-3850 doi:10.1063/1.122913
Gungor, M. Rauf, Maroudas, Dimitrios (2007) Stress-induced deceleration of electromigration-driven void motion in metallic thin films. Journal of Applied Physics, 101 (6). 63513pp. doi:10.1063/1.2709616
Cho, Jaeseol, Gungor, M. Rauf, Maroudas, Dimitrios (2004) Electromigration-driven motion of morphologically stable voids in metallic thin films: Universal scaling of migration speed with void size. Applied Physics Letters, 85 (12). 2214-2216 doi:10.1063/1.1790037
Cho, Jaeseol, Gungor, M. Rauf, Maroudas, Dimitrios (2005) Effects of electromigration-induced void dynamics on the evolution of electrical resistance in metallic interconnect lines. Applied Physics Letters, 86 (24). 241905pp. doi:10.1063/1.1947373
Gungor, M.Rauf, Maroudas, Dimitrios (1999) Nonhydrostatic stress effects on failure of passivated metallic thin films due to void surface electromigration. Surface Science, 432 (3). doi:10.1016/s0039-6028(99)00655-x
Maroudas, Dimitrios (1995) Dynamics of transgranular voids in metallic thin films under electromigration conditions. Applied Physics Letters, 67 (6). 798-800 doi:10.1063/1.115471
Gungor, M. Rauf, Maroudas, Dimitrios, Zhou, Shujia (2000) Molecular-dynamics study of the mechanism and kinetics of void growth in ductile metallic thin films. Applied Physics Letters, 77 (3). 343-345 doi:10.1063/1.126971
Cho, Jaeseol, Gungor, M. Rauf, Maroudas, Dimitrios (2005) Electromigration-induced wave propagation on surfaces of voids in metallic thin films: Hopf bifurcation for high grain symmetry. Surface Science, 575 (1). doi:10.1016/j.susc.2004.11.011
Gungor, M. Rauf, Maroudas, Dimitrios (2005) Relaxation of biaxial tensile strain in ultrathin metallic films: Ductile void growth versus nanocrystalline domain formation. Applied Physics Letters, 87 (17). 171913pp. doi:10.1063/1.2108128
Cho, Jaeseol, Gungor, M. Rauf, Maroudas, Dimitrios (2008) Hopf bifurcation, bistability, and onset of current-induced surface wave propagation on void surfaces in metallic thin films. Surface Science, 602 (6). 1227-1242 doi:10.1016/j.susc.2008.01.021
 
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