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Liu, Jianghao, Niu, Xinhuan, Zhan, Ni, Zou, Yida, Yan, Han, Qu, Minghui, Luo, Fu, Shi, Yunhui, Zhou, Jianwei (2023) Inhibition Effect and Mechanism of 2-Mercaptopyrimidine on Cobalt-Based Copper Interconnects Chemical Mechanical Polishing: Combined Experimental and DFT Study. Journal of The Electrochemical Society, 170 (10) 101501 doi:10.1149/1945-7111/ad0077

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Reference TypeJournal (article/letter/editorial)
TitleInhibition Effect and Mechanism of 2-Mercaptopyrimidine on Cobalt-Based Copper Interconnects Chemical Mechanical Polishing: Combined Experimental and DFT Study
JournalJournal of The Electrochemical Society
AuthorsLiu, JianghaoAuthor
Niu, XinhuanAuthor
Zhan, NiAuthor
Zou, YidaAuthor
Yan, HanAuthor
Qu, MinghuiAuthor
Luo, FuAuthor
Shi, YunhuiAuthor
Zhou, JianweiAuthor
Year2023 (October 1)Volume170
Issue10
PublisherThe Electrochemical Society
DOIdoi:10.1149/1945-7111/ad0077Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID16896812Long-form Identifiermindat:1:5:16896812:3
GUID0
Full ReferenceLiu, Jianghao, Niu, Xinhuan, Zhan, Ni, Zou, Yida, Yan, Han, Qu, Minghui, Luo, Fu, Shi, Yunhui, Zhou, Jianwei (2023) Inhibition Effect and Mechanism of 2-Mercaptopyrimidine on Cobalt-Based Copper Interconnects Chemical Mechanical Polishing: Combined Experimental and DFT Study. Journal of The Electrochemical Society, 170 (10) 101501 doi:10.1149/1945-7111/ad0077
Plain TextLiu, Jianghao, Niu, Xinhuan, Zhan, Ni, Zou, Yida, Yan, Han, Qu, Minghui, Luo, Fu, Shi, Yunhui, Zhou, Jianwei (2023) Inhibition Effect and Mechanism of 2-Mercaptopyrimidine on Cobalt-Based Copper Interconnects Chemical Mechanical Polishing: Combined Experimental and DFT Study. Journal of The Electrochemical Society, 170 (10) 101501 doi:10.1149/1945-7111/ad0077
In(2023, October) Journal of the Electrochemical Society Vol. 170 (10) The Electrochemical Society

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